Base Material: FR4
Board Thickness: 1.6mm
Board Size: Customized
Copper Thickness: 1 - 4OZ
Min. Hole Size: 0.3mm
Min. Line Width: 0.1mm
Min. Line Spacing: 0.1mm
Surface Finishing: OSP,Immersion Gold,Immersion Tin,Immersion Ag
Minimum solder resist opening: 1.5mil
Minimum solder resist bridge: 3mil
Maximum aspect Ratio: 10:01
Impedance control accuracy: ±8%
Maximum board size: 550*1200mm
Maximum layer: 2
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