PRODUCT DISPLAY

Base Material: FR4/CEM-1/CEM-3/FR1/Aluminum

Board Thickness: 0.4 - 2mm

Board Size: Customized

Copper Thickness: 0.5 - 4.5OZ

Min. Hole Size: 0.3mm

Min. Line Width: 0.1mm

Min. Line Spacing: 0.1mm

Surface Finishing: OSP,Immersion Gold,Immersion Tin,Immersion Ag

Minimum solder resist opening: 1.5mil

Minimum solder resist bridge: 3mil

Maximum aspect Ratio: 10:01

Impedance control accuracy: ±8%

Maximum board size: 550*1200mm

Maximum layer: 2