- Base Material: FR4/22F
- Board Thickness: 0.4 - 2mm
- Board Size: Customized
- Copper Thickness: 0.5 - 4.5OZ
- Min. Hole Size: 0.3mm
- Min. Line Width: 0.1mm
- Min. Line Spacing: 0.1mm
- Surface Finishing: OSP,Immersion Gold,Immersion Tin,Immersion Ag
- Minimum solder resist opening: 1.5mil
- Minimum solder resist bridge: 3mil
- Maximum aspect Ratio: 10:01
- Impedance control accuracy: ±8%
- Maximum board size: 550*1200mm